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According to the Bank’s website, the proposed investment is a sustainability linked loan (SLL) of up to US$400 million (or equivalent in Euros), including up to US$250 million (or equivalent in Euros) for IFC’s own account and up to US$150 million (or equivalent in Euros) in potential mobilization, to AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn. Bhd. (“AT&S Malaysia” or the “Company”). AT&S Malaysia is a wholly owned subsidiary of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (“AT&S Austria”). AT&S Austria is a leading global manufacturer of high-end printed circuit boards (PCBs) and integrated circuit (IC) substrates. AT&S Malaysia was incorporated in June 2021 to house greenfield integrated circuit (IC) substrate manufacturing plant in Kulim, Malaysia for some of the key customers. IFC’s financing will be utilised to fund the capital expenditure and associated start-up costs / effects (i.e. the expenses until the commencement of mass production) for the first phase of this plant (the “Project”).
AT&S Austria has a focus on sustainability and targets to reduce absolute Scope 1 and 2 GHG emissions by 38% by 2030/31 (compared to a baseline of 2021/22). The Project is aligned with the goals of the Paris Agreement.
This is a Category B Project. IFC’s loan is solely for IC substrates plant under construction in Kulim Hi-Tech Industrial Park, in Malaysia. The recently completed facility will not be expanded or result in additional E&S risks as part of the investment. Key E&S risks include: (i) need to have a completed and functioning ESMS and capacity to meet IFC PS during operations, including contractor management; (ii) labour, working conditions and OHS; (iii) high energy and water use, pollution prevention controls due to use of hazardous chemicals, solvents, waste handling and wastewater management of metal contaminated etching rinse water; (iv) community health and safety through the project life cycle; (v) supply chain risks (copper, gold and laminates); and (vi) stakeholder engagement given close proximity to residential areas.
The total cost of the Project is estimated at approximately US$ 1 billion which will be financed by (i) up to US$250 million (or equivalent in Euros) A Loan for IFC’s own account; (ii) up to US$150 million (or equivalent in Euros) in potential mobilization through B1 Loan and/or Parallel Loans to be provided by other lenders; and (iii) equity and customer advances for the remaining balance.
AT&S Malaysia is a 100% owned subsidiary of AT&S Austria. AT&S Austria is a leading global manufacturer of high-end printed circuit boards (PCBs) and integrated circuit (IC) substrates, founded in 1987 and is currently listed on the Vienna Stock Exchange with a market cap of US$905 million (as of October 10, 2024). Mr. Hannes Androsch and Mr. Willi Dorflinger, along with the related entities own 35.68% of the shares in AT&S Austria while the remaining 64.32% (as of March 31, 2024) of the shares are owned by public shareholders on a free float basis.
Private Actor 1 | Private Actor 1 Role | Private Actor 1 Sector | Relation | Private Actor 2 | Private Actor 2 Role | Private Actor 2 Sector |
---|---|---|---|---|---|---|
- | - | - | - | AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn. Bhd. | Client | - |
- | - | - | - | AT&S Austria Technologie & Systemtechnik Aktiengesellschaft | Parent Company | - |
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Klopf Siegfried
Head of Treasury Management
+43 3842 200 2167
s.klopf@ats.net
Fabriksgasse 13, 8700 Leoben, Austria
www.ats.net
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